title: "NIO's Chip Unit Pitches 700+ TOPS M97 to Leapmotor and Geely" slug: nio-chip-leapmotor-geely-deals date: 2026-03-19 category: technology tags: [nio, chips, autonomous, leapmotor, geely, china] source_url: "https://cnevpost.com/2026/03/18/nio-chip-unit-approaches-leapmotor-geely-for-potential-supply-deals/"
NIO's chip subsidiary Shenji (GeniTech) is actively pitching its M97 smart driving chip to Leapmotor and Geely, according to Chinese outlet 36kr. The M97 delivers over 700 TOPS of computing power, benchmarking above Horizon Robotics' 560-TOPS Journey J6P, and is scheduled for release in Q3 2026.
The M97 was co-developed with Axera Semiconductor through a joint venture that also includes OmniVision Integrated Circuits. Engineering teams from both NIO and Axera collaborated on a customized chip built on Shenji's core modules and architecture. NIO has already generated hundreds of millions of yuan in revenue from this technology licensing arrangement.
Why Leapmotor and Geely Want It
Leapmotor and other Chinese automakers are seeking cost-effective, high-computing-power domestic chips to replace expensive Nvidia alternatives. Horizon Robotics' J6P chip was sold bundled with proprietary algorithms until late 2025, restricting automaker autonomy in developing their own assisted driving technologies. That forced bundling created a market window for NIO and Axera.
A lower-end chip codenamed 9031e is also in development, targeting the 128-TOPS segment against Horizon's J6M. This gives Shenji a two-tier product lineup covering both premium and mid-range autonomous driving applications.
The Bigger Picture
NIO spun off its chip operations into Shenji last year. All NIO-branded models have transitioned from Nvidia chips to the in-house NX9031 since its production start in 2024, with cumulative shipments exceeding 150,000 units. Shenji raised 2.257 billion yuan ($330 million) in its first funding round in February 2026, valuing the unit at 8.27 billion yuan.
Selling chips to competitors transforms NIO from a vehicle manufacturer into a technology supplier, a model that mirrors what Huawei has done with its HIMA alliance but through silicon rather than software.
